整機參數/ Machine Specifications:
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設備外形尺寸/Equipment Dimensions (mm)
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WxLxH:800x1400x1600
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設備正壓/ Positive Pressue (Kpa)
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0.4~0.6
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設備總功率/Total Power (KW)
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0.5kw
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技術特點/Features:
通過高精度數字相機對硅片攝像后進行圖像處理,將已經破損與有缺陷的硅片自動從運輸軌道上清除,從而保證進入印刷環節沒有不良硅片,減少槳料印刷的損失.而且已經從運輸軌道上清除下來的硅片會保存在一固定冶具中,可以非常方便地取出.
檢測機還帶有緩存硅片的功能,這樣就可以盡可能減少其它環節出現故障所帶有的產能影響.
同時,檢測機還帶有翻板功能,需要翻板時則可以使用,不需要時則直接過板,由此可以實現工藝的變更而不需變更產線的設備重新擺放.
Take photo for wafer through high-precision digital camera, then image processing. It can automatic clear broken and defective wafer form conveyor. So can guarantee there is no unqualified wafer in the printing process and reduce printing wastage of glue. And the wafer have been clear from conveyor will keep in fixed jig. It is easy to take out.
Detector is also with cache wafer function. So that can reduce productivity influence caused by go wrong in other process.
Besides, Detector is also with the function of flipping wafer. Can choose flip wafer, if don’t need that pass directly. So it can realize process modifications instead of changing the machine placement.